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1 Ergebnisse
1
Electromigration in tin-bismuth planar solder joints:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Singh, Prabjit
;
Palmer, L.
;
Hamid, M.
... - p. 201-202 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129714
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Electromigration in tin-bismuth planar solder joints</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129714&Exemplar=1&LAN=DE A1 Singh, Prabjit A1 Palmer, L. A1 Hamid, M. A1 Wassick, T. A1 Aspandiar, R. F. A1 Franco, B. A1 Fu, H. A1 Coyle, Richard A1 Hadian, Faramarz A1 Vasudevan, V. A1 Allen, A. A1 Howell, K. A1 Murayama, K. A1 Zhang, H. A1 Lifton, A. A1 Ribas, M. A1 Sarangapani, M. A1 Munson, T. A1 Middleton, S. YR 2023 K1 Electromigration K1 Resistance K1 Geometry K1 Temperature distribution K1 Bismuth K1 Real-time systems K1 Soldering K1 tin-bismuth K1 planar solder geometry K1 back stress SP 201 OP 202 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129714 DO https://doi.org/10.23919/ICEP58572.2023.10129714 SF ELIB - SuUB Bremen
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