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1 Ergebnisse
1
Thin Die Flip Chip Process Enablement for Stacked IC Memory..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Huang, Chen-Yu
;
Lee, Jungbae
;
Chiang, Tsung-Han
... - p. 51-52 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129716
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Thin Die Flip Chip Process Enablement for Stacked IC Memory Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129716&Exemplar=1&LAN=DE A1 Huang, Chen-Yu A1 Lee, Jungbae A1 Chiang, Tsung-Han A1 Lin, Kohan A1 Gan, Chong Leong A1 Jensen, Travis YR 2023 K1 Stacking K1 Resists K1 Behavioral sciences K1 Finite element analysis K1 Flip-chip devices K1 Joining processes K1 Integrated circuit modeling K1 Flip Chip K1 Warpage K1 Chip Package Interaction K1 IC Memory Stacking SP 51 OP 52 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129716 DO https://doi.org/10.23919/ICEP58572.2023.10129716 SF ELIB - SuUB Bremen
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