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1 Ergebnisse
1
AOI Pattern Detection Study for Fine Pitch Advanced Substra..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Xue, Feng
;
Zou, Zhihua
;
Reynolds, Charles
... - p. 3-4 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129720
RT T1
2023 International Conference on Electronics Packaging (ICEP)
: T1
AOI Pattern Detection Study for Fine Pitch Advanced Substrate
UL https://suche.suub.uni-bremen.de/peid=ieee-10129720&Exemplar=1&LAN=DE A1 Xue, Feng A1 Zou, Zhihua A1 Reynolds, Charles A1 Wassick, Tom A1 Pomerantz, Glenn A1 Tang, Neil A1 Cheng, ChaoLin A1 Martell, Steven A1 Tsuriya, Masahiro YR 2023 K1 Wiring K1 TV K1 System-in-package K1 Phase measurement K1 Optical interconnections K1 Printed circuits K1 Multichip modules K1 AOI K1 Advanced Substrate K1 Defect Detection K1 Inspection K1 Fine Pitch Patterns SP 3 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129720 DO https://doi.org/10.23919/ICEP58572.2023.10129720 SF ELIB - SuUB Bremen
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