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1 Ergebnisse
1
Direct Cu electroplating on CoWB electroless barrier layer:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Chen, Shaohan
;
Shiraiwa, Naoya
;
Saida, Ryota
... - p. 229-230 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129727
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Direct Cu electroplating on CoWB electroless barrier layer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129727&Exemplar=1&LAN=DE A1 Chen, Shaohan A1 Shiraiwa, Naoya A1 Saida, Ryota A1 Shimizu, Tomohiro A1 Ito, Takeshi A1 Shingubara, Shoso YR 2023 K1 Electrochemical deposition K1 Annealing K1 Additives K1 Adhesives K1 Metals K1 Plating K1 Filling K1 3-D integration technologies K1 Copper K1 TSV K1 Electroless barrier metal SP 229 OP 230 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129727 DO https://doi.org/10.23919/ICEP58572.2023.10129727 SF ELIB - SuUB Bremen
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