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1 Ergebnisse
1
Rapid silver sinter joining technology for large area chips:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Zhang, Luobin
;
Chen, Chuantong
;
Huo, Fupeng
.. - p. 249-250 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129731
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Rapid silver sinter joining technology for large area chips</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129731&Exemplar=1&LAN=DE A1 Zhang, Luobin A1 Chen, Chuantong A1 Huo, Fupeng A1 Li, Wangyun A1 Suganuma, Katsuaki YR 2023 K1 Silver K1 Temperature distribution K1 Preforms K1 Silicon carbide K1 Sintering K1 High frequency K1 Soldering K1 Rapid K1 Large-area bonding K1 Silver sinter joining technology K1 SiC SP 249 OP 250 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129731 DO https://doi.org/10.23919/ICEP58572.2023.10129731 SF ELIB - SuUB Bremen
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