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1 Ergebnisse
1
Effect of Etching Gas on Adhesion between Mold Resin and Sp..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Homma, Soichi
;
Okada, Daichi
;
Sawanobori, Akihito
... - p. 113-114 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129739
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Effect of Etching Gas on Adhesion between Mold Resin and Sputtered Stainless Steel Ground Films in Electromagnetic Shield Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129739&Exemplar=1&LAN=DE A1 Homma, Soichi A1 Okada, Daichi A1 Sawanobori, Akihito A1 Yamamoto, Susumu A1 Imoto, Takashi A1 Nishikawa, Hiroshi YR 2023 K1 Silicon compounds K1 Adhesives K1 Films K1 Semiconductor devices K1 Moisture K1 Etching K1 Resins K1 shield package K1 etching K1 adhesion K1 mold resin K1 stainless steel SP 113 OP 114 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129739 DO https://doi.org/10.23919/ICEP58572.2023.10129739 SF ELIB - SuUB Bremen
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