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1 Ergebnisse
1
Copper contamination control in Hybrid Copper Bonding:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Kim, Wooyoung
;
Han, Seung Ho
;
Lee, Yongin
... - p. 41-42 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129740
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Copper contamination control in Hybrid Copper Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129740&Exemplar=1&LAN=DE A1 Kim, Wooyoung A1 Han, Seung Ho A1 Lee, Yongin A1 Shin, Donggap A1 Choi, Wonyoung A1 Moon, Jiwon A1 Lim, Kyeongbin A1 Moon, BumKi A1 Rhee, Minwoo Daniel YR 2023 K1 Three-dimensional displays K1 Plasmas K1 Dielectrics K1 Copper K1 Bonding K1 Contamination K1 Faces K1 Copper contamination K1 Contamination free K1 In-situ clean K1 Plasma K1 Hybrid copper bonding SP 41 OP 42 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129740 DO https://doi.org/10.23919/ICEP58572.2023.10129740 SF ELIB - SuUB Bremen
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