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1 Ergebnisse
1
Direct bonding of germanium and diamond substrates by hydro..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Minowa, Yuki
;
Matsumae, Takashi
;
Hayase, Masanori
.. - p. 171-172 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129744
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Direct bonding of germanium and diamond substrates by hydrophilic bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129744&Exemplar=1&LAN=DE A1 Minowa, Yuki A1 Matsumae, Takashi A1 Hayase, Masanori A1 Kurashima, Yuichi A1 Takagi, Hideki YR 2023 K1 Heating systems K1 Diamonds K1 Conductivity K1 Germanium K1 Thermal conductivity K1 Solids K1 Plasmas K1 germanium K1 diamond K1 direct bonding K1 hydrophilic bonding K1 oxygen plasma SP 171 OP 172 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129744 DO https://doi.org/10.23919/ICEP58572.2023.10129744 SF ELIB - SuUB Bremen
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