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1 Ergebnisse
1
Optimizing activation process for strong direct bonding bet..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Okita, S.
;
Matsumae, T.
;
Kurashima, Y.
... - p. 261-262 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129745
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Optimizing activation process for strong direct bonding between diamond and Si substrates</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129745&Exemplar=1&LAN=DE A1 Okita, S. A1 Matsumae, T. A1 Kurashima, Y. A1 Takagi, H. A1 Umezawa, H. A1 Hayase, M. YR 2023 K1 Military standards K1 Heating systems K1 Semiconductor devices K1 Hydrogen K1 Diamonds K1 Silicon K1 Plasmas K1 diamond K1 direct bonding K1 hydrophilic bonding K1 plasma activation SP 261 OP 262 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129745 DO https://doi.org/10.23919/ICEP58572.2023.10129745 SF ELIB - SuUB Bremen
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