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1 Ergebnisse
1
Effect of Thermal Cycle Temperature Gap on Thermal Fatigue ..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Miyazaki, Hiroyuki
;
Ngo, Minh Chu
;
Hirao, Kiyoshi
. - p. 95-96 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129746
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Effect of Thermal Cycle Temperature Gap on Thermal Fatigue of Metallized Silicon Nitride Substrates for SiC Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129746&Exemplar=1&LAN=DE A1 Miyazaki, Hiroyuki A1 Ngo, Minh Chu A1 Hirao, Kiyoshi A1 Fukushima, Manabu YR 2023 K1 Temperature K1 Silicon carbide K1 Thermal shock K1 Multichip modules K1 Silicon nitride K1 Liquid nitrogen K1 Fatigue K1 Metallized ceramic substrate K1 Thermal fatigue K1 Power module K1 Thermal cycle SP 95 OP 96 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129746 DO https://doi.org/10.23919/ICEP58572.2023.10129746 SF ELIB - SuUB Bremen
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