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1 Ergebnisse
1
Stress relaxation structure using Ni nano-particle/Al micro..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Tanaka, Y.
;
Kitaguchi, Y.
;
Koshiba, K.
.. - p. 231-232 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129759
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Stress relaxation structure using Ni nano-particle/Al micro-particle composite paste for power device packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129759&Exemplar=1&LAN=DE A1 Tanaka, Y. A1 Kitaguchi, Y. A1 Koshiba, K. A1 Iizuka, T. A1 Tatsumi, K. YR 2023 K1 Nanoparticles K1 Performance evaluation K1 Thermal expansion K1 Sintering K1 Nickel K1 Nanoscale devices K1 Finite element analysis K1 High Temperature Resistant Packaging K1 Power Device K1 Ni Nano-particles K1 Al Micro-particles K1 Die Bonding K1 Difference in Coefficient of Thermal Expansion (CTE) SP 231 OP 232 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129759 DO https://doi.org/10.23919/ICEP58572.2023.10129759 SF ELIB - SuUB Bremen
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