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1 Ergebnisse
1
Evaluation of Thermal Resistance Reduction by Thinning Subs..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Seki, Shota
;
Funaki, Tsuyoshi
;
Arima, Jun
... - p. 193-194 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129761
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Evaluation of Thermal Resistance Reduction by Thinning Substrate of β-Ga2O3 SBD</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129761&Exemplar=1&LAN=DE A1 Seki, Shota A1 Funaki, Tsuyoshi A1 Arima, Jun A1 Fujita, Minoru A1 Hirabayashi, Jun A1 Hanabusa, Kazuyoshi YR 2023 K1 Silicon carbide K1 Photonic band gap K1 Thermal resistance K1 High-voltage techniques K1 Electronic packaging thermal management K1 Thermal conductivity K1 Power dissipation K1 β-Ga2O3 K1 Gallium Oxide K1 SBD K1 thermal resistance K1 wide bandgap SP 193 OP 194 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129761 DO https://doi.org/10.23919/ICEP58572.2023.10129761 SF ELIB - SuUB Bremen
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