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Development of Ultra-Low Chlorine Epoxy Resins for Highly R..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Yoshimura, Ryo
;
Urano, Wataru
;
Asuma, Yuuki
. - p. 119-120 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129763
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Development of Ultra-Low Chlorine Epoxy Resins for Highly Reliable Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129763&Exemplar=1&LAN=DE A1 Yoshimura, Ryo A1 Urano, Wataru A1 Asuma, Yuuki A1 Ota, Kazumasa YR 2023 K1 Viscosity K1 Liquids K1 Purification K1 Chlorine K1 Epoxy resins K1 Metals K1 Packaging K1 epoxy resin K1 low chlorine content K1 handleability K1 highly reliable K1 semiconductor package SP 119 OP 120 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129763 DO https://doi.org/10.23919/ICEP58572.2023.10129763 SF ELIB - SuUB Bremen
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