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1 Ergebnisse
1
Time Evolution Study of Two-Step Plasma-Treated Copper-Copp..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Hu, Liangxing
;
Lim, Yu Dian
;
Zhao, Peng
... - p. 45-46 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129764
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Time Evolution Study of Two-Step Plasma-Treated Copper-Copper Direct Bonding in Ambient</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129764&Exemplar=1&LAN=DE A1 Hu, Liangxing A1 Lim, Yu Dian A1 Zhao, Peng A1 Zhong Lim, Michael Joo A1 Miao, Weiyang A1 Dinh, Van Quy A1 Ju, Xin A1 Tan, Chuan Seng YR 2023 K1 Three-dimensional displays K1 Annealing K1 Multichip modules K1 Copper K1 Bonding K1 Electronics packaging K1 Time evolution study K1 plasma treatment K1 die-die bonding K1 copper-copper direct bonding K1 ambient condition SP 45 OP 46 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129764 DO https://doi.org/10.23919/ICEP58572.2023.10129764 SF ELIB - SuUB Bremen
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