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1 Ergebnisse
1
Influence of interfacial interaction on the reliability of ..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Zhao, Shuaijie
;
Chen, Chuantong
;
Ueshima, Minoru
.. - p. 91-92 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129766
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129766&Exemplar=1&LAN=DE A1 Zhao, Shuaijie A1 Chen, Chuantong A1 Ueshima, Minoru A1 Haga, Motoharu A1 Suganuma, Katsuaki YR 2023 K1 Encapsulation K1 Degradation K1 Thermal expansion K1 Multichip modules K1 Humidity K1 Copper K1 Reliability K1 power module K1 epoxy encapsulation K1 reliability SP 91 OP 92 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129766 DO https://doi.org/10.23919/ICEP58572.2023.10129766 SF ELIB - SuUB Bremen
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