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1 Ergebnisse
1
Effect of Tafel slope on the difference deposition rate at ..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Akita, A.
;
Hashimoto, D.
;
Kiso, M.
. - p. 175-176 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129781
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Effect of Tafel slope on the difference deposition rate at 2CD (circle diameter) wafer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129781&Exemplar=1&LAN=DE A1 Akita, A. A1 Hashimoto, D. A1 Kiso, M. A1 Hashimoto, S. YR 2023 K1 Electrochemical deposition K1 Metals K1 Ions K1 Electronics packaging K1 2CD (2 circle diameter) wafer K1 Tafel slope K1 Different thickness K1 Acid copper K1 FIB SP 175 OP 176 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129781 DO https://doi.org/10.23919/ICEP58572.2023.10129781 SF ELIB - SuUB Bremen
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