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1
Analytical study on stress and strain of power chip laminat..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
X.H., Luan
;
L.G., Ding
;
X.M., Li
... - p. 267-268 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129786
RT T1
2023 International Conference on Electronics Packaging (ICEP)
: T1
Analytical study on stress and strain of power chip laminated structure
UL https://suche.suub.uni-bremen.de/peid=ieee-10129786&Exemplar=1&LAN=DE A1 X.H., Luan A1 L.G., Ding A1 X.M., Li A1 H.J., Zhang A1 K.W., Li A1 L.Z., Zhou A1 F.S., Wu YR 2023 K1 Young's modulus K1 Thermal expansion K1 Simulation K1 Mathematical models K1 Finite element analysis K1 Stress K1 Thermal stresses K1 Power chip K1 Laminated structure K1 Physical parameters SP 267 OP 268 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129786 DO https://doi.org/10.23919/ICEP58572.2023.10129786 SF ELIB - SuUB Bremen
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