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1 Ergebnisse
1
Thermal Characteristics of Liquid Metal Interconnects for P..:
, In:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Sun, Zhongchao
;
Jorgensen, Asger Bjorn
;
Baker, Nick
... - p. 1135-1140 , 2023
Link:
https://doi.org/10.1109/APEC43580.2023.10131435
RT T1 <cTitle>2023 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10131435&Exemplar=1&LAN=DE A1 Sun, Zhongchao A1 Jorgensen, Asger Bjorn A1 Baker, Nick A1 Beczkowski, Szymon A1 Guo, Wendi A1 Munk-Nielsen, Stig A1 Iannuzzo, Francesco YR 2023 SN 2470-6647 K1 Liquids K1 Temperature K1 Thermal resistance K1 Wires K1 Metals K1 Voltage K1 Packaging K1 liquid metal K1 wire-bonding K1 thermal characteristics K1 packaging K1 simulation SP 1135 OP 1140 LK http://dx.doi.org/https://doi.org/10.1109/APEC43580.2023.10131435 DO https://doi.org/10.1109/APEC43580.2023.10131435 SF ELIB - SuUB Bremen
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