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1 Ergebnisse
1
Fabrication and Experimental Validation of Low Inductance S..:
, In:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Chen, Hao
;
Lin, Yujui
;
Wei, Tiwei
... - p. 366-371 , 2023
Link:
https://doi.org/10.1109/APEC43580.2023.10131620
RT T1 <cTitle>2023 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10131620&Exemplar=1&LAN=DE A1 Chen, Hao A1 Lin, Yujui A1 Wei, Tiwei A1 Li, Xiaoling A1 Paul, Riya A1 Whitt, Reece A1 Song, Xiaoqing A1 Zhao, Yue A1 Asheghi, Mehdi A1 Mantooth, H. Alan YR 2023 SN 2470-6647 K1 Fabrication K1 Inductance K1 Silicon carbide K1 Thermal resistance K1 Multichip modules K1 Switches K1 Thermal force K1 SiC power module K1 low parasitic inductance K1 integration K1 microchannel cooling SP 366 OP 371 LK http://dx.doi.org/https://doi.org/10.1109/APEC43580.2023.10131620 DO https://doi.org/10.1109/APEC43580.2023.10131620 SF ELIB - SuUB Bremen
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