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Demonstration of A 3D Chip by Logic-DRAM Stacked Using Pair..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Chen, Chun Cheng ; Lin, Sheng-Chieh... - p. 1-2 , 2023
Link: https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10..