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1 Ergebnisse
1
Interface tailoring for CMOS, cryogenic electronics, and be..:
, In:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)
,
Wan, H. W.
;
Cheng, Y. T.
;
Young, L. B.
... - p. 1-2 , 2023
Link:
https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10..
RT T1 <cTitle>2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)</cTitle>: T1 <Title>Interface tailoring for CMOS, cryogenic electronics, and beyond</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10134236&Exemplar=1&LAN=DE A1 Wan, H. W. A1 Cheng, Y. T. A1 Young, L. B. A1 Cheng, C. K. A1 Chen, W. S. A1 Lin, Y. H. G. A1 Hsu, C. H. A1 Pi, T. W. A1 Lin, Y. H. A1 Kwo, J. A1 Hong, M. YR 2023 K1 Cryogenic electronics K1 Superconducting thin films K1 Very large scale integration K1 Germanium K1 Indium gallium arsenide K1 Silicon K1 Superconducting epitaxial layers SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134236 DO https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134236 SF ELIB - SuUB Bremen
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