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1 Ergebnisse
1
Low-temperature & high yield transfer approaches for embedd..:
, In:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)
,
Wu, Bi-Xian
;
Lin, Rong-Teng
;
Chang, Tzu-Hsuan
- p. 1-2 , 2023
Link:
https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10..
RT T1 <cTitle>2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)</cTitle>: T1 <Title>Low-temperature & high yield transfer approaches for embedding the 4th generation semiconductor Ga2O3 on the high thermal conductive substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10134255&Exemplar=1&LAN=DE A1 Wu, Bi-Xian A1 Lin, Rong-Teng A1 Chang, Tzu-Hsuan YR 2023 K1 Thermal management of electronics K1 Heating systems K1 Very large scale integration K1 Thermal conductivity K1 Thermal management K1 Surface roughness K1 Silicon SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134255 DO https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134255 SF ELIB - SuUB Bremen
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