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1 Ergebnisse
1
Integrated High Aspect Ratio 3D High Density Capacitor in S..:
, In:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)
,
Lu, Chun-Lin
;
Ho, Cheng-Shu
;
Liu, Kuo-Wei
... - p. 1-2 , 2023
Link:
https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10..
RT T1
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)
: T1
Integrated High Aspect Ratio 3D High Density Capacitor in Si Interposer for 2.5D Advanced Packaging Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-10134362&Exemplar=1&LAN=DE A1 Lu, Chun-Lin A1 Ho, Cheng-Shu A1 Liu, Kuo-Wei A1 Wang, Guan-Deng A1 Ju, Min-Syong A1 So, Ka Man A1 Shih, Kai-Yao A1 Liao, Miller A1 Chang, Shou-Zen YR 2023 K1 Three-dimensional displays K1 System-in-package K1 Capacitors K1 Very large scale integration K1 Capacitance K1 Routing K1 Silicon SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134362 DO https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134362 SF ELIB - SuUB Bremen
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