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1 Ergebnisse
1
Characterization and thermal steadiness of trenched stepped..:
, In:
2023 IEEE Devices for Integrated Circuit (DevIC)
,
Mishra, Sikha
;
Mohanty, Soumya S.
;
Mishra, Guru Prasad
- p. 124-128 , 2023
Link:
https://doi.org/10.1109/DevIC57758.2023.10134812
RT T1
2023 IEEE Devices for Integrated Circuit (DevIC)
: T1
Characterization and thermal steadiness of trenched stepped gate SON MOSFET for future CMOS devices
UL https://suche.suub.uni-bremen.de/peid=ieee-10134812&Exemplar=1&LAN=DE A1 Mishra, Sikha A1 Mohanty, Soumya S. A1 Mishra, Guru Prasad YR 2023 K1 Performance evaluation K1 MOSFET K1 Temperature K1 Switches K1 Logic gates K1 Stability analysis K1 Circuit stability K1 corner angle K1 trenched gate K1 stepped gate K1 negative junction depth K1 corner effect SP 124 OP 128 LK http://dx.doi.org/https://doi.org/10.1109/DevIC57758.2023.10134812 DO https://doi.org/10.1109/DevIC57758.2023.10134812 SF ELIB - SuUB Bremen
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