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1 Ergebnisse
1
Physical Mechanism and Data Hybrid Modeling for Device-Leve..:
, In:
2023 8th Asia Conference on Power and Electrical Engineering (ACPEE)
,
Xie, Minhua
;
Peng, Yixuan
;
Zhang, Jiayuan
... - p. 1557-1561 , 2023
Link:
https://doi.org/10.1109/ACPEE56931.2023.10135874
RT T1 <cTitle>2023 8th Asia Conference on Power and Electrical Engineering (ACPEE)</cTitle>: T1 <Title>Physical Mechanism and Data Hybrid Modeling for Device-Level Emulation of Modular Multilevel Converter</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10135874&Exemplar=1&LAN=DE A1 Xie, Minhua A1 Peng, Yixuan A1 Zhang, Jiayuan A1 Tang, Haijun A1 Zhu, Ruimin A1 Fan, Wei YR 2023 K1 Semiconductor device modeling K1 Insulated gate bipolar transistors K1 Multilevel converters K1 Simulation K1 Training data K1 Valves K1 Data models K1 Insulated gate bipolar diode K1 Physical mechanism model K1 Data model K1 Digital twin SP 1557 OP 1561 LK http://dx.doi.org/https://doi.org/10.1109/ACPEE56931.2023.10135874 DO https://doi.org/10.1109/ACPEE56931.2023.10135874 SF ELIB - SuUB Bremen
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