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1
End-to-End Optimization of High-Density e-Skin Design: From..:
, In:
2023 Design, Automation & Test in Europe Conference & Exhibition (DATE)
,
Wang, Jiaqi
;
Alea, Mark Daniel
;
Van Assche, Jonah
. - p. 1-6 , 2023
Link:
https://doi.org/10.23919/DATE56975.2023.10137077
RT T1
2023 Design, Automation & Test in Europe Conference & Exhibition (DATE)
: T1
End-to-End Optimization of High-Density e-Skin Design: From Spiking Taxel Readout to Texture Classification
UL https://suche.suub.uni-bremen.de/peid=ieee-10137077&Exemplar=1&LAN=DE A1 Wang, Jiaqi A1 Alea, Mark Daniel A1 Van Assche, Jonah A1 Gielen, Georges G.E. YR 2023 SN 1558-1101 K1 Measurement K1 Power demand K1 Tactile sensors K1 Encoding K1 Recording K1 System-on-chip K1 Optimization K1 electronic skin K1 spiking readout K1 neuromorphic K1 end-to-end optimization K1 spike encoding metrics SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/DATE56975.2023.10137077 DO https://doi.org/10.23919/DATE56975.2023.10137077 SF ELIB - SuUB Bremen
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