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Thermal characteristic analysis of integrated circuit packa..:
, In:
2023 5th International Conference on Communications, Information System and Computer Engineering (CISCE)
,
Huang, Feijie
;
Ruan, Zhijie
;
Wang, Jiahe
... - p. 185-191 , 2023
Link:
https://doi.org/10.1109/CISCE58541.2023.10142931
RT T1 <cTitle>2023 5th International Conference on Communications, Information System and Computer Engineering (CISCE)</cTitle>: T1 <Title>Thermal characteristic analysis of integrated circuit package design and silicon chip health status evaluation considering the inverter heat source</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10142931&Exemplar=1&LAN=DE A1 Huang, Feijie A1 Ruan, Zhijie A1 Wang, Jiahe A1 Hu, Qiulei A1 Zuo, Qihui A1 Ma, Yonghu YR 2023 SN 2833-2423 K1 Support vector machines K1 Analytical models K1 Thermal resistance K1 Thermal engineering K1 Inverters K1 Silicon K1 Thermal analysis K1 integrated circuit K1 thermal characterization K1 finite element K1 inverter K1 SSA-SVM SP 185 OP 191 LK http://dx.doi.org/https://doi.org/10.1109/CISCE58541.2023.10142931 DO https://doi.org/10.1109/CISCE58541.2023.10142931 SF ELIB - SuUB Bremen
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