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1
Kirkendall Voids in Soft Soldered Power Packages:
, In:
2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
,
Boettcher, Tim
;
Ilicali, Gurkan
;
Birkoben, Tom
... - p. 302-305 , 2023
Link:
https://doi.org/10.1109/ISPSD57135.2023.10147426
RT T1 <cTitle>2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)</cTitle>: T1 <Title>Kirkendall Voids in Soft Soldered Power Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10147426&Exemplar=1&LAN=DE A1 Boettcher, Tim A1 Ilicali, Gurkan A1 Birkoben, Tom A1 Fan, Haibo A1 Haenze, Max A1 Sabelfeld, Alex A1 Kahl, Soenke YR 2023 SN 1946-0201 K1 Temperature sensors K1 Thermomechanical processes K1 Lead K1 Robustness K1 Iron K1 Temperature control K1 Power semiconductor devices K1 Soft solder K1 Kirkendall voids K1 thermomechanic robustness SP 302 OP 305 LK http://dx.doi.org/https://doi.org/10.1109/ISPSD57135.2023.10147426 DO https://doi.org/10.1109/ISPSD57135.2023.10147426 SF ELIB - SuUB Bremen
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