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CVD TiSiN diffusion barrier integration in sub-130 mn techn..:

, In: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519),
Prindle, C. ; Brennan, B. ; Denning, D.... - p. 182,183,184 , 2002
Link: https://doi.org/10.1109/IITC.2002.1014927