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Electrothermal modeling of Multilayer Graphene Nanoribbon (..:
, In:
2023 International Symposium on Devices, Circuits and Systems (ISDCS)
,
Tunga, Santasri Giri
;
Das, Subhajit
;
Bhattacharya, Sandip
. - p. 01-04 , 2023
Link:
https://doi.org/10.1109/ISDCS58735.2023.10153552
RT T1 <cTitle>2023 International Symposium on Devices, Circuits and Systems (ISDCS)</cTitle>: T1 <Title>Electrothermal modeling of Multilayer Graphene Nanoribbon (MLGNR) Interconnect considering Energy-per-Layer Screening</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10153552&Exemplar=1&LAN=DE A1 Tunga, Santasri Giri A1 Das, Subhajit A1 Bhattacharya, Sandip A1 Rahaman, Hafizur YR 2023 SN 2767-9837 K1 Resistance K1 Temperature distribution K1 Electric potential K1 Graphene K1 Integrated circuit interconnections K1 Very large scale integration K1 Nonhomogeneous media K1 Electrothermal interconnect model K1 Intercalation doped MLGNR K1 Fermi screening K1 Interlayer screening length K1 Electrothermal resistance SP 01 OP 04 LK http://dx.doi.org/https://doi.org/10.1109/ISDCS58735.2023.10153552 DO https://doi.org/10.1109/ISDCS58735.2023.10153552 SF ELIB - SuUB Bremen
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