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1
The Formation of Ru/ZnO Multifunctional Bilayer through Are..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Mori, Yuki
;
Cheon, Taehoon
;
Kotsugi, Yohei
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154647
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>The Formation of Ru/ZnO Multifunctional Bilayer through Area Selective Atomic Layer Deposition for Advanced Cu Metallization</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154647&Exemplar=1&LAN=DE A1 Mori, Yuki A1 Cheon, Taehoon A1 Kotsugi, Yohei A1 Kim, Youn-Hye A1 Kwon, Woobin A1 Park, Young-Bae A1 Kim, Soo-Hyun YR 2023 SN 2380-6338 K1 Temperature measurement K1 Metallization K1 II-VI semiconductor materials K1 Adhesives K1 Atomic layer deposition K1 Silicides K1 Energy measurement K1 diffusion barrier K1 area-selective atomic layer deposition K1 ZnO K1 Cu metallization K1 Ru liner SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154647 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154647 SF ELIB - SuUB Bremen
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