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1 Ergebnisse
1
3D Integration for Modular Quantum Computer based on Diamon..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Ishihara, R.
;
Hermias, J.
;
Neji, S.
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154649
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>3D Integration for Modular Quantum Computer based on Diamond Spin Qubits</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154649&Exemplar=1&LAN=DE A1 Ishihara, R. A1 Hermias, J. A1 Neji, S. A1 Yu, K. Y. A1 van der Maas, M. A1 Nur, S. A1 Iwai, T. A1 Miyatake, T. A1 Miyahara, S. A1 Kawaguchi, K. A1 Sato, S. YR 2023 SN 2380-6338 K1 Quantum entanglement K1 Metallization K1 Qubit K1 Diamonds K1 Routing K1 Optical fiber communication K1 Large scale integration K1 Quantum computer K1 3D integration K1 Photonic circuits K1 Flip-chip bonding SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154649 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154649 SF ELIB - SuUB Bremen
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