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1
Two-level Semi-damascene interconnect with fully self-align..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Marti, Giulio
;
Pokhrel, Ankit
;
Murdoch, Gayle
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154682
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Two-level Semi-damascene interconnect with fully self-aligned Vias at MP18</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154682&Exemplar=1&LAN=DE A1 Marti, Giulio A1 Pokhrel, Ankit A1 Murdoch, Gayle A1 Delie, Gilles A1 Gupta, Anshul A1 Marien, Philippe A1 Lesniewska, Alicja A1 Decoster, Stefan A1 Kundu, Souvik A1 Le, Quoc Toan A1 Oniki, Yusuke A1 Kenens, Bart A1 Hermans, Yanick A1 Park, Seongho A1 Tokei, Zsolt YR 2023 SN 2380-6338 K1 Resistance K1 Ruthenium K1 Metallization K1 Etching K1 fully self-aligned vias K1 Semi-damascene K1 Interconnect K1 Subtractive etch K1 BEOL SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154682 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154682 SF ELIB - SuUB Bremen
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