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Extreamly Advanced Cu Interconnect with Selective ALD Barri..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Jang, Junki ; Park, Kyoungpil ; Park, Chibeom... - p. 1-3 , 2023

Link: https://doi.org/10.1109/IITC/MAM57687.2023.10154689

RT 
T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Extreamly Advanced Cu Interconnect with Selective ALD Barrier for High Performance Logic Device</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10154689&Exemplar=1&LAN=DE
				
A1 Jang, Junki
A1 Park, Kyoungpil
A1 Park, Chibeom
A1 Yoo, Seungyong
A1 Cha, Seungkeun
A1 Nam, Kyounghee
A1 Kim, Kihyun
A1 Son, Jeongwook
A1 Park, Eunyoung
A1 Lee, Jaeho
A1 Kim, Joosung
A1 Lee, Miji
A1 Yeo, Myungsoo
A1 Jung, EunJi
A1 Kim, Rak-Hwan
A1 Park, Doohwan
A1 Kim, Chin
A1 Choi, Yunki
A1 Ha, Taehong
A1 Ahn, Jeonghoon
A1 Ku, Jahum
YR 2023
SN 2380-6338
K1 Performance evaluation
K1 Resistance
K1 Metallization
K1 Atomic layer deposition
K1 Foundries
K1 Logic devices
K1 Cu
K1 Barrierless
K1 ALD TaN
SP 1
OP 3
LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154689
DO https://doi.org/10.1109/IITC/MAM57687.2023.10154689
SF ELIB - SuUB Bremen

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