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1 Ergebnisse
1
Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track S..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Marien, P.
;
Gonzalez, V. V.
;
Choudhury, S.
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154710
RT T1
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
: T1
Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track Standard Cell Architecture as Scaling Booster
UL https://suche.suub.uni-bremen.de/peid=ieee-10154710&Exemplar=1&LAN=DE A1 Marien, P. A1 Gonzalez, V. V. A1 Choudhury, S. A1 Radisic, D. A1 Decoster, S. A1 Kundu, S. A1 Hermans, Y. A1 Kenens, B. A1 De Coster, H. A1 Sanchez, E. A. A1 Peter, A. A1 Marquez, A. S. A1 Jourdan, N. A1 Batuk, D. A1 Ryckaert, J. A1 Murdoch, G. A1 Park, S. A1 Tokei, Z. YR 2023 SN 2380-6338 K1 Metallization K1 Electric variables measurement K1 Computer architecture K1 Standards K1 MOL scaling booster K1 VHV K1 self-aligned tip-to-tip K1 Ru direct metal etch SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154710 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154710 SF ELIB - SuUB Bremen
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