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1 Ergebnisse
1
Exploring the Benefits of Cryogenic Temperatures for Co and..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Tierno, Davide
;
Ciofi, Ivan
;
Pedreira, Olalla Varela
.. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154717
RT T1
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
: T1
Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations
UL https://suche.suub.uni-bremen.de/peid=ieee-10154717&Exemplar=1&LAN=DE A1 Tierno, Davide A1 Ciofi, Ivan A1 Pedreira, Olalla Varela A1 Parvais, Bertrand A1 Croes, Kristof YR 2023 SN 2380-6338 K1 Resistance K1 Cryogenic electronics K1 Metallization K1 Cryogenics K1 Conductivity K1 Benchmark testing K1 Boosting K1 Alternative metals K1 Co K1 cryogenic electronics K1 Cu K1 HPC K1 interconnects K1 resistance K1 Ru K1 TCR SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154717 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154717 SF ELIB - SuUB Bremen
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