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Galvanic displacement deposition of Ag using citric acid fo..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Kim, Youjung
;
Yoon, Sanghwa
;
Han, Haneul
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154719
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Galvanic displacement deposition of Ag using citric acid for Cu-to-Cu hybrid bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154719&Exemplar=1&LAN=DE A1 Kim, Youjung A1 Yoon, Sanghwa A1 Han, Haneul A1 Seo, Jinmyeong A1 Park, Jungjoon A1 Yoo, Bongyoung YR 2023 SN 2380-6338 K1 Scanning electron microscopy K1 Spectroscopy K1 Metallization K1 Surface morphology K1 Morphology K1 Bonding K1 Surface treatment K1 hybrid bonding K1 galvanic displacement K1 Ag interdiffusion SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154719 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154719 SF ELIB - SuUB Bremen
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