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Towards Enabling Two Metal Level Semi-Damascene Interconnec..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Pokhrel, Ankit ; Gupta, Anshul ; Kim, Min-Soo... - p. 1-3 , 2023

Link: https://doi.org/10.1109/IITC/MAM57687.2023.10154725

RT 
T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10154725&Exemplar=1&LAN=DE
				
A1 Pokhrel, Ankit
A1 Gupta, Anshul
A1 Kim, Min-Soo
A1 Soulie, Jean-Philippe
A1 Sarkar, Sujan Kumar
A1 Canvel, Yann
A1 Renaud, Vincent
A1 Kenens, Bart
A1 Hodges, Blake
A1 Josephsen, Trent
A1 O'Neal, Sabine
A1 Herr, Quentin
A1 Herr, Anna
A1 Tokei, Zsolt
YR 2023
SN 2380-6338
K1 Temperature measurement
K1 Resistance
K1 Superconducting devices
K1 Superconducting thin films
K1 Superconducting materials
K1 Superconducting logic circuits
K1 Current measurement
K1 Interconnect
K1 BEOL
K1 Semi-damascene
K1 Line Resistance
K1 Leakage Current
K1 NbxTi(1-x)N
K1 Superconductors
K1 Tc
SP 1
OP 3
LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154725
DO https://doi.org/10.1109/IITC/MAM57687.2023.10154725
SF ELIB - SuUB Bremen

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