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1 Ergebnisse
1
Advanced BEOL process integration for logic technology node:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Park, Chanhoo
;
Choi, Minkwon
;
Kim, ChangHyun
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154737
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Advanced BEOL process integration for logic technology nodes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154737&Exemplar=1&LAN=DE A1 Park, Chanhoo A1 Choi, Minkwon A1 Kim, ChangHyun A1 Koo, Bonhyeok A1 Kweon, O Young A1 Park, Jinhyeung A1 Jung, Juyoung A1 Choi, Yunki A1 Lee, Kyoung-Woo A1 Ahn, Jeong Hoon A1 Ku, Ja-Hum YR 2023 SN 2380-6338 K1 Resistance K1 Rails K1 Degradation K1 Metallization K1 Ultraviolet sources K1 Throughput K1 Dielectrics K1 BEOL K1 EUV K1 multi patterning K1 sacrificial oxide layer SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154737 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154737 SF ELIB - SuUB Bremen
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