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1 Ergebnisse
1
Improving uniformity of 3-level High Aspect Ratio Supervias:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Montero, D.
;
Marien, P.
;
Hermans, Y.
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154787
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Improving uniformity of 3-level High Aspect Ratio Supervias</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154787&Exemplar=1&LAN=DE A1 Montero, D. A1 Marien, P. A1 Hermans, Y. A1 Vega-Gonzalez, V. A1 Feurprier, Y. A1 Oikawa, N. A1 Buccheri, N. A1 Wu, C. A1 Martinez, G.T. A1 Batuk, D. A1 Puliyalil, H. A1 Decoster, S. A1 Kumar, K. A1 Lazzarino, F. A1 Murdoch, G. A1 Park, S. A1 Tokei, Z. YR 2023 SN 2380-6338 K1 Electric potential K1 Damascene integration K1 Metallization K1 Dielectrics K1 High-aspect ratio via K1 Supervia K1 BEOL K1 Ru K1 scaling booster SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154787 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154787 SF ELIB - SuUB Bremen
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