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1 Ergebnisse
1
The Second Generation of Integrated Stack Capacitor (ISC) f..:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Park, Won Ji
;
Oh, Jae Hee
;
Ding, Shaofeng
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154813
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>The Second Generation of Integrated Stack Capacitor (ISC) for Power Integrity Improvement</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154813&Exemplar=1&LAN=DE A1 Park, Won Ji A1 Oh, Jae Hee A1 Ding, Shaofeng A1 Jang, Woo Seong A1 Kim, Hyung Won A1 Hyun, Young Bin A1 Kim, Tae Kyun A1 Nam, Seung Ki A1 Son, Jung Il A1 Moon, Seong Wook A1 Ahn, Jeong Hoon A1 Ku, Ja Hum A1 Kim, Sunoo YR 2023 SN 2380-6338 K1 Radio frequency K1 Semiconductor device modeling K1 Metallization K1 Capacitors K1 Semiconductor device reliability K1 Voltage K1 Capacitance K1 Integrated stack capacitor (ISC) K1 Decoupling capacitor K1 high-k material SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154813 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154813 SF ELIB - SuUB Bremen
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