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1 Ergebnisse
1
Surface Topography Control on Cu Pad for Hybrid Bonding:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Nakayama, Kohei
;
Iwata, Tomoya
;
Ebiko, Sodai
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154869
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>Surface Topography Control on Cu Pad for Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154869&Exemplar=1&LAN=DE A1 Nakayama, Kohei A1 Iwata, Tomoya A1 Ebiko, Sodai A1 Mai, La Thi Ngoc A1 Harada, Ken A1 Yokoyama, Masahiro A1 Kawase, Yasuhiro A1 Inoue, Fumihiro YR 2023 SN 2380-6338 K1 Surface cleaning K1 Surface contamination K1 Corrosion K1 Surface roughness K1 Surface topography K1 Rough surfaces K1 Plasmas K1 3D Integration K1 CMP K1 Hybrid Bonding SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154869 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154869 SF ELIB - SuUB Bremen
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