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1 Ergebnisse
1
3D Thin Film Metrology without Cross-Sectional Sampling:
, In:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
,
Philip, Anish
;
Utriainen, Mikko
;
Werner, Thomas
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IITC/MAM57687.2023.10154886
RT T1 <cTitle>2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)</cTitle>: T1 <Title>3D Thin Film Metrology without Cross-Sectional Sampling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10154886&Exemplar=1&LAN=DE A1 Philip, Anish A1 Utriainen, Mikko A1 Werner, Thomas A1 Hyttinen, Pasi A1 Saarilahti, Jaakko A1 Kinnunen, Jussi A1 Gao, Feng YR 2023 SN 2380-6338 K1 Three-dimensional displays K1 Metallization K1 Semiconductor devices K1 Metrology K1 Silicon K1 Coatings K1 Substrates K1 PillarHall®LHAR4 K1 conformal coating K1 penetration depth K1 pocket wafer SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC/MAM57687.2023.10154886 DO https://doi.org/10.1109/IITC/MAM57687.2023.10154886 SF ELIB - SuUB Bremen
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