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Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Murugesan, M. ; Sawa, M. ; Sone, E.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/3DIC57175.2023.10154924