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1 Ergebnisse
1
Thermal Estimation for 3D-ICs Through Generative Networks:
, In:
2023 IEEE International 3D Systems Integration Conference (3DIC)
,
Kashyap, Priyank
;
Ravichandiran, Prasanth P.
;
Wang, Lee
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/3DIC57175.2023.10154977
RT T1
2023 IEEE International 3D Systems Integration Conference (3DIC)
: T1
Thermal Estimation for 3D-ICs Through Generative Networks
UL https://suche.suub.uni-bremen.de/peid=ieee-10154977&Exemplar=1&LAN=DE A1 Kashyap, Priyank A1 Ravichandiran, Prasanth P. A1 Wang, Lee A1 Baron, Dror A1 Wong, Chau-Wai A1 Wu, Tianfu A1 Franzon, Paul D. YR 2023 SN 2836-4902 K1 Temperature distribution K1 Three-dimensional displays K1 Layout K1 Estimation K1 System integration K1 Silicon K1 Transistors K1 3DIC K1 thermal K1 generative K1 GAN K1 hybrid-bonding SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/3DIC57175.2023.10154977 DO https://doi.org/10.1109/3DIC57175.2023.10154977 SF ELIB - SuUB Bremen
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