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Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Naeim, Mohamed ; Yang, Hanqi ; Chen, Pinhong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/3DIC57175.2023.10155075