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1 Ergebnisse
1
The Control of Substrate Flatness for Flexible LCP-based De..:
, In:
2023 Second International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)
,
Wang, Kang
;
Han, Lei
;
Xu, Yaxin
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/ICEEICT56924.2023.10157635
RT T1 <cTitle>2023 Second International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)</cTitle>: T1 <Title>The Control of Substrate Flatness for Flexible LCP-based Devices by Temporary Bonding and Two-step Etching Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10157635&Exemplar=1&LAN=DE A1 Wang, Kang A1 Han, Lei A1 Xu, Yaxin A1 Chai, Zhaoer A1 Ren, Jiawei A1 Wang, Jie A1 Wang, Ziyuan A1 Qin, Ming A1 Zhao, Fei YR 2023 K1 Wet etching K1 Lasers K1 Insertion loss K1 Crystals K1 Information and communication technology K1 Polymers K1 Bonding K1 flexible substrate K1 temporary bonding K1 two-step etching K1 liquid crystal polymer K1 microspring structure SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEEICT56924.2023.10157635 DO https://doi.org/10.1109/ICEEICT56924.2023.10157635 SF ELIB - SuUB Bremen
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