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1 Ergebnisse
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Numerical modelling approaches to current reflow soldering ..:
, In:
2023 46th International Spring Seminar on Electronics Technology (ISSE)
,
Bozsoki, Istvan
;
Geczy, Attila
;
Illes, Balazs
- p. 1-6 , 2023
Link:
https://doi.org/10.1109/ISSE57496.2023.10168319
RT T1
2023 46th International Spring Seminar on Electronics Technology (ISSE)
: T1
Numerical modelling approaches to current reflow soldering applications: a brief overview
UL https://suche.suub.uni-bremen.de/peid=ieee-10168319&Exemplar=1&LAN=DE A1 Bozsoki, Istvan A1 Geczy, Attila A1 Illes, Balazs YR 2023 SN 2161-2536 K1 Semiconductor device modeling K1 Temperature measurement K1 Temperature distribution K1 Computational modeling K1 Thermomechanical processes K1 Surface mount technology K1 Mathematical models K1 reflow soldering K1 numerical model K1 heat transfer K1 thermomechanical stress SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ISSE57496.2023.10168319 DO https://doi.org/10.1109/ISSE57496.2023.10168319 SF ELIB - SuUB Bremen
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