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Methodology for Solderability Measurement of Plated Through..:
, In:
2023 46th International Spring Seminar on Electronics Technology (ISSE)
,
Kralova, Iva
;
Klimtova, Marketa
;
Vesely, Petr
- p. 1-6 , 2023
Link:
https://doi.org/10.1109/ISSE57496.2023.10168410
RT T1
2023 46th International Spring Seminar on Electronics Technology (ISSE)
: T1
Methodology for Solderability Measurement of Plated Through Holes Using Wetting Balance Test
UL https://suche.suub.uni-bremen.de/peid=ieee-10168410&Exemplar=1&LAN=DE A1 Kralova, Iva A1 Klimtova, Marketa A1 Vesely, Petr YR 2023 SN 2161-2536 K1 Temperature measurement K1 Seminars K1 Temperature distribution K1 Force K1 Lead K1 Market research K1 Electron tubes K1 lead-free soldering K1 meniscograph K1 solderability K1 wettability K1 wetting balance test SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ISSE57496.2023.10168410 DO https://doi.org/10.1109/ISSE57496.2023.10168410 SF ELIB - SuUB Bremen
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