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1 Ergebnisse
1
Achieving Last-Mile Functional Coverage in Testing Chip Des..:
, In:
2023 IEEE/ACM 45th International Conference on Software Engineering: Software Engineering in Practice (ICSE-SEIP)
,
Yan, Ming
;
Chen, Junjie
;
Mao, Hangyu
... - p. 343-354 , 2023
Link:
https://doi.org/10.1109/ICSE-SEIP58684.2023.00037
RT T1 <cTitle>2023 IEEE/ACM 45th International Conference on Software Engineering: Software Engineering in Practice (ICSE-SEIP)</cTitle>: T1 <Title>Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10172806&Exemplar=1&LAN=DE A1 Yan, Ming A1 Chen, Junjie A1 Mao, Hangyu A1 Jiang, Jiajun A1 Hao, Jianye A1 Li, Xingjian A1 Tian, Zhao A1 Chen, Zhichao A1 Li, Dong A1 Xian, Zhangkong A1 Guo, Yanwei A1 Liu, Wulong A1 Wang, Bin A1 Sun, Yuefeng A1 Cui, Yongshun YR 2023 SN 2832-7659 K1 Radio frequency K1 Machine learning K1 Generative adversarial networks K1 Feature extraction K1 Software K1 Hardware K1 Software reliability K1 Chip Design Testing K1 Test Generation K1 Functional Coverage K1 Machine Learning SP 343 OP 354 LK http://dx.doi.org/https://doi.org/10.1109/ICSE-SEIP58684.2023.00037 DO https://doi.org/10.1109/ICSE-SEIP58684.2023.00037 SF ELIB - SuUB Bremen
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